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Thermal activation of rupture and slow crack growth in a model of homogenous brittle materials

机译:断裂热激活和慢速裂纹扩展模型   均质脆性材料

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摘要

Slow crack growth in a model of homogenous brittle elastic material isdescribed as a thermal activation process where stress fluctuations allow toovercome a breaking threshold through a series of irreversible steps. We studythe case of a single crack in a flat sheet for which analytical predictions canbe made, and compare them with results from the equivalent problem of a 2Dspring network. Good statistical agreement is obtained for the crack growthprofile and final rupture time. The specific scaling of the energy barrier withstress intensity factor appears as a consequence of irreversibility. Inaddition, the model brings out a characteristic growth length whose physicalmeaning could be tested experimentally.
机译:均质脆性弹性材料模型中的缓慢裂纹扩展被描述为一种热激活过程,其中应力波动允许通过一系列不可逆的步骤克服破坏阈值。我们研究了可以进行分析预测的平板中单个裂纹的情况,并将其与二维弹簧网络等效问题的结果进行比较。裂纹扩展曲线和最终破裂时间获得了良好的统计一致性。势垒应力强度因子的特定比例是不可逆性的结果。此外,该模型还具有特征性的生长长度,其物理意义可以通过实验进行测试。

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